Micro Electronic Technology Development Application Corp. In Shijiazhuang Development Zone
Main products:GaAs MMIC Products,Microwave Packaged Circuits,Microwave Module,RF/Digital Circuit,Microwave FET
Products
Contact Us
  • Contact Person : Ms. Wu Judy
  • Company Name : Micro Electronic Technology Development Application Corp. In Shijiazhuang Development Zone
  • Tel : 86-311-87091914
  • Fax : 86-311-87042577
  • Address : Hebei,Shijiazhuang,113# HEZUO ROAD
  • Country/Region : China
  • Zip : 050051

Butterfly Package

Butterfly Package
Product Detailed
can be made multi-layer metal wiring, equipped with a 50 ohm characteristic impedance transmission connector to meet 10Gbps

       Specification

Part number

Dimension (mm)

Number of lead

Lead pitch

(mm)

Useful frequency

(Gbps)

Hermiticity

(Pa·m3/s)

Isolation resistance

(Ω)

Plating thickness

(μm)

with GPO connector

OEP27

30×12.7×7.7

 

7

2.54

10

≤1×10-9

≥1.0×1010

≥1.3

OEP37

30×12.7×9.07

 

7

2.54

10

≤1×10-9

≥1.0×1010

≥1.3

OEP47

30×12.7×10

 

7

2.54

10

≤1×10-9

≥1.0×1010

≥1.3

Common Type

OEP28

30×12.7×7.7

 

14

2.54

<2.5

≤1×10-9

≥1.0×1010

≥1.3

OEP09

30×12.7×9.2

 

14

2.54

<2.5

≤1×10-9

≥1.0×1010

≥1.3

OEP34

OEP39A

30×12.7×7.7

 

14

2.54

<2.5

≤1×10-9

≥1.0×1010

≥1.3

OEP44

30×12.7×8.5

 

14

2.54

<2.5

≤1×10-9

≥1.0×1010

≥1.3

10Gbutterfly package

OEP31

30×12.7×7.0

 

14

2.54

10

≤1×10-9

≥1.0×1010

≥1.3

BF14B

The package is metal wall - ceramic insulator structure, dimensions conform to international standards. Ceramic pieces can be made multi-layer metal wiring, and can be equipped with a 50 ohm characteristic impedance transmission connector to meet 10Gbps and transmission rate to use, applicable to a variety of light transmitting and receiving module package. Customized products can be offered according to specific request.

Butterfly Package



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